Case study · Electronics & Semiconductors
An HBM capacity forecast that unlocked a two-year fab-utilisation commitment.
A tier-2 memory foundry needed defensible view on high-bandwidth-memory demand through 2028 before signing a long-dated capacity commitment to a hyperscaler.
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A hyperscaler had approached the client with a two-year, take-or-pay HBM3E capacity commitment. Signing would lock ~40% of the fab's output but insulate the client from a demand air-pocket if AI capex softened. The board needed independent evidence on where HBM demand was actually going.
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A three-analyst team modelled HBM demand bottom-up from GPU shipment forecasts across the top 8 accelerator programs, cross-checked against foundry capacity announcements. We ran primary conversations with three hyperscaler procurement leads (under NDA) and two competing memory manufacturers. Weekly interim reads with the client's corporate development team.
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A 92-page report, a live Excel demand-supply model with three demand scenarios, a supplier-competitor teardown, and two board-level presentation decks (one for the buy-side committee, one for the hyperscaler negotiation).
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The client signed the commitment at a valuation ~9% higher than the hyperscaler's opening offer, backed by our demand model. Fab utilisation is now locked through 2027. The corporate development team retained us for a follow-on study on adjacent packaging capacity.
Client identity is anonymised in this write-up. On-record versions are available on request where the client has given explicit consent — reach the desk for named references.
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