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IC Socket Market

Published Date : Jun 2024 | Forecast Year : 2019

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IC Socket Market Size, share, Industry trends Segmentation Analysis by Type (Dual In-Line Memory Module Sockets (DIMM), Production Sockets, Test/Burn-In Sockets, Through-hole Sockets, Surface-mount Sockets, Zero Insertion Force (ZIF) Sockets, Dual-row Sockets, Other) by Application (Memory, CMOS Image Sensors, High Voltage, Radio Frequency (RF), System on Chip (SoC), Central Processing Unit (CPU), Graphics Processing Unit (GPU), Other Non-memory) Growth, demand, Regional Outlook, and Forecast 2023-2032

Report ID: AG167

Published : Jun 2024

Pages : 152

Format : IC Socket Market

REPORT ATTRIBUTEDETAILS
MARKET SIZE (2032)USD 2.4 Billion
MARKET SIZE (2023)USD 820 Million
CAGR (2023-2029)8.77%
HISTORIC YEAR2019
BASE YEAR2023
FORECAST YEAR2032
BY TYPEDual In-Line Memory Module Sockets (DIMM)
Production Sockets
Test/Burn-In Sockets
Through-hole Sockets
Surface-mount Sockets
Zero Insertion Force (ZIF) Sockets
Dual-row Sockets
Other
BY APPLICATIONMemory
CMOS Image Sensors
High Voltage
Radio Frequency (RF)
System on Chip (SoC)
Central Processing Unit (CPU)
Graphics Processing Unit (GPU)
Other Non-memory
GEOGRAPHIC ANALYSISNorth America, Europe, Asia Pacific, Latin America, and Middle East & Africa
KEY PLAYERSChupond Precision Co., Ltd. (Taiwan), Foxconn Technology Group (Taiwan), Win Way Technology Co., Ltd. (Taiwan), Yamaichi Electronics Co., Ltd. (Japan), Enplas Corporation (Japan), Aries Electronics (U.S.), 3M Company (U.S.), FCI (U.S.), Johnstech International Corporation (U.S.), Loranger International Corporation (U.S.), Mill-Max Mfg. Corporation (U.S.), Molex, Inc (U.S.), Plastronics Socket Company, Inc (U.S.), Sensata Technologies B.V. (U.S.), Tyco Electronics Ltd. (U.S.), TE Connectivity Ltd., Smith’s Interconnect Inc., Yamaichi Electronics Co., Ltd., Enplass Corporation, ISC Co Ltd, Leeno Industrial Inc, Sensata Technologies Inc, Ironwood Electronics Inc, Plastronics Socket Company Inc., INNO Global Corporation.

IC Socket Market Overview

IC Socket Market size is predicted to cross USD 2.4 Billion by the end of 2032, expanding around 8.77% CAGR during the forecast period i.e., 2024-2032. In the year 2023, the industry size of IC socket was over USD 820 Million.

Integrated circuits are at the heart of a wide variety of electronic devices, from smartphones and laptops to automotive systems and IoT devices. By making devices smaller, faster, and more efficient, they have transformed industries such as telecommunications, computers, and consumer electronics. Additionally, the increasing demand for consumer and automotive electronics will drive the proliferation of integrated circuits and thus IC sockets. Integrated circuits were the second most traded product globally in 2021, with a total transaction value of USD 823 billion. Exports of integrated circuits increased by 23.8% from USD 665 billion to USD 823 billion between 2020 and 2021. Integrated circuit trade accounts for 3.91% of total world trade.

IC Socket Market

Size, by Product, - (USD Billion)

Dual In-Line Memory Module Sockets (DIMM)

Production Sockets

Test/Burn-In Sockets

Through-hole Sockets

Other Products

18 16 14 12 10 8 6 4 2 0

The Market will Grow

At the CAGR of:

8.77%

The Forecast Market

Size for in USD:

$2.4 BillionB

b0d51e3055fd6f23ff6a384a6e091406.svg

IC Socket Sector: Growth Drivers and Challenges

Growth Drivers

  • Expansion of 5G Technology - The introduction and expansion of 5G technology have significantly increased the demand for high-speed data transmission, low latency, and improved connectivity. 5G networks rely on dense network infrastructure such as base stations and data centers. Additionally, as of September 2023, the United States had 5,375 data centers, more than any other country in the world. A further 522 cases were found in Germany and 517 in the UK. These infrastructure components use plastic IC sockets to ensure reliable connectivity and efficient data transfer.
  • Growing Demand in Telecommunication Sector - The telecommunications industry is looking for IC sockets that can meet the high frequency and bandwidth requirements of 5G technology. Plastic IC sockets, with their advanced thermal and electrical properties, are ideal for this purpose. Furthermore, as of the end of 2022, the number of smartphone subscriptions worldwide reached approximately 6.6 billion. The deployment of 5G networks and the demand for high-speed data transmission are creating opportunities for resin-based IC sockets to be used in networking and communication equipment.
  • Rapid Development in Resin based IC Sockets - The electrical insulation and thermal properties of the resin based IC sockets are designed to be excellent. They are capable of transmitting data at high speeds and reducing the risk of electromagnetic interference. These properties will be even more important in order to ensure the reliability and performance of computerized systems, as IC design becomes increasingly complex.

Challenges

  • Availability of Substitute Materials - The utilization of resin-based IC sockets may be hindered by the presence of more appropriate alternatives, such as metal alloys or ceramics, for particular applications. Plastic is a common material used to make integrated circuit sockets because of its affordability and electrical insulating properties. Both traditional IC sockets and DIP sockets frequently employ this material. Ceramic versions perform better in heat resistance than their plastic equivalents, which makes them perfect for situations where high-temperature stability is required. High-power or high-energy integrated circuits are utilized with these sockets. Therefore, increasing availability of alternative materials are set to pose a competition on the growth of product. Therefore, it is predicted to hamper the IC socket market growth in the coming future times.
  • High Cost of IC Socket is Predicted to Hamper the Market Growth in the Forecast Period
  • Environmental Concerns Associated with IC Socket are Expected to Pose Limitations on the Market Growth in the Estimated Period. 

    IC Socket Market

    Share, by end user, (USD Billion)

    Analytica Global 820 Million%

    Memory

    CMOS Image Sensors

    High Voltage

    Radio Frequency (RF)

    Other End-Users

    b0d51e3055fd6f23ff6a384a6e091406.svg

    2.4 Billion

    Total Market Size

    USD (Billion),

    8.77%

    CAGR

    -

IC Socket Market Leaders

  • Chupond Precision Co., Ltd. (Taiwan)
  • Foxconn Technology Group (Taiwan)
  • Win Way Technology Co., Ltd. (Taiwan)
  • Yamaichi Electronics Co., Ltd. (Japan)
  • Enplas Corporation (Japan)
  • Aries Electronics (U.S.)
  • 3M Company (U.S.)
  • FCI (U.S.)
  • Johnstech International Corporation (U.S.)
  • Loranger International Corporation (U.S.)
  • Mill-Max Mfg. Corporation (U.S.)
  • Molex, Inc (U.S.)
  • Plastronics Socket Company, Inc (U.S.)
  • Sensata Technologies B.V. (U.S.)
  • Tyco Electronics Ltd. (U.S.)
  • TE Connectivity Ltd.
  • Smith’s Interconnect Inc.
  • Yamaichi Electronics Co., Ltd.
  • Enplass Corporation
  • ISC Co Ltd
  • Leeno Industrial Inc
  • Sensata Technologies Inc
  • Ironwood Electronics Inc
  • Plastronics Socket Company Inc.
  • INNO Global Corporation
  • IC Socket Market

    Size, by Product, - (USD Billion)

    NORTH AMERICA $ 2024

    The Market will Grow

    At the CAGR of:

    8.77%

    The Forecast Market

    Size for in USD:

    $2.4 BillionB

    b0d51e3055fd6f23ff6a384a6e091406.svg

IC Sockets Market Segmentation

By Type

  • Dual In-Line Memory Module Sockets (DIMM)
  • Production Sockets
  • Test/Burn-In Sockets
  • Through-hole Sockets
  • Surface-mount Sockets
  • Zero Insertion Force (ZIF) Sockets
  • Dual-row Sockets
  • Other

By Application

  • Memory
  • CMOS Image Sensors
  • High Voltage
  • Radio Frequency (RF)
  • System on Chip (SoC)
  • Central Processing Unit (CPU)
  • Graphics Processing Unit (GPU)
  • Other Non-memory

Recent Development

  • November 2023: BTQ Technologies Corp., through its subsidiary BTQ AG, has partnered with Foxconn Technology Group's Hon Hai Research Institute for a two-year collaboration on post-quantum cryptography (PQC) standards. Initiated two years ago, the collaboration resulted in a joint report submitted to the U.S. National Institute of Standards and Technology (NIST) in response to the call for PQC standards. The report, addressing digital signature schemes, was officially published in July. NIST's PQC standardization project, launched in 2016, aims to establish quantum-resistant cryptographic algorithms. This collaboration strengthens the ties between BTQ and Hon Hai Research Institute, showcasing their commitment to advancing PQC standards internationally.
  • In March 2020, TE Connectivity Ltd announced its acquisition of First Sensor AG, a leading sensor solutions provider. This strategic acquisition aimed to enhance TE Connectivity's sensor portfolio and expand its capabilities in the rapidly growing sensor sector. The acquisition aligned with TE Connectivity's focus on providing innovative solutions for a wide range of sectors, including automotive, industrial, and medical.
  • In December 2020, WinWay, a prominent IC test equipment manufacturer, revealed plans to expand its production capacity for high-end IC test equipment. This expansion aims to meet the increasing demand for advanced IC testing solutions in the semiconductor sector. The move also reflects WinWay's commitment to providing cutting-edge technology and catering to the evolving needs of the market.

    IC Socket Market TO (USD BN)

    IC Socket Market

    CAGR OF

    8.77%

    IC Socket Market

    b0d51e3055fd6f23ff6a384a6e091406.svg
    Analytica Global 2.4 Billion%

Conclusion

The IC socket market is poised for substantial growth, driven by the increasing adoption of integrated circuits (ICs) across diverse applications like 5G, IoT, data centers, and automotive electronics. With an expected CAGR of 10% from 2021 to 2028, reaching USD 2.4 billion by 2036, the market is propelled by the demand for high-speed data transmission, low latency, and enhanced connectivity solutions. This growth is further supported by advancements in IC technologies such as LPDDR5 DRAM and the proliferation of electric and autonomous vehicles.

However, the market faces challenges including the availability of substitute materials like metal alloys and ceramics which may hinder the adoption of plastic IC sockets. Moreover, environmental concerns and the high cost associated with IC sockets pose additional constraints on market expansion.

Key players such as Chupond Precision Co., Ltd., Foxconn Technology Group, and Yamaichi Electronics Co., Ltd. are pivotal in driving innovation and market competitiveness. Strategic initiatives such as partnerships for post-quantum cryptography standards and acquisitions to enhance sensor capabilities underscore the industry's dynamic nature and commitment to technological advancement.

Overall, the IC socket market is poised to evolve significantly, driven by technological innovations, expanding applications, and strategic collaborations that aim to address emerging challenges and capitalize on growth opportunities in the global electronics landscape.

IC Socket Market - Global Outlook & Forecast 2024-2029

Analytica Global
Analytica Global
Analytica Global
Analytica Global
Analytica Global
Analytica Global
Analytica Global
Analytica Global
Analytica Global
Analytica Global
Analytica Global
Analytica Global

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